Indena 2025 Global Sources Hong Kong Spring Shows 3V13 31/03/2025 Indena-Spring 2025 Global Sources Hong Kong Shows 3V13 (Not in the exhibition hall,opposite KFC in the east lobby)
Founded chip packaging (Bonding)workshop 01/12/2021 Bonding (Chip package) Department is also one of the highly automated departments of our company. The whole process of the packaging and testing of module