Bonding (Chip package) Department is also one of the highly automated departments of our company. The whole process of the packaging and testing of module of the wireless mouse transmitter and part chip of the receiver is implemented here.

Our bonding machines are imported from ASM.
The process from cleaning the PCB, dispensing, frozen crystal, welding, to sealing, are all through visual control automation production. Welding daily production capacity is up to 3 million lines.

What is even more praiseworthy is that the one-time pass-through yield rate of the products in this department reached 99.8% and ranked among the forefront of the industry. It is the most efficient department in our single production process.