Exhibition：HK Global Sources Consumer Electronics Spring ShowDate：11-Apr-23 to 14-Apr-23Address：Asia-World Expo(Airport), Hong Kong SARBooth No.：8B40, 8D40, 8D39 Warmly welcome visit our booth , expect to see

Bonding (Chip package) Department is also one of the highly automated departments of our company. The whole process of the packaging and testing of module

The leader and teachers from Guilin University of Electronic Technology visited our company and authorized our company as their teaching practice base.