INDENA attend The 32nd China (Shenzhen) International Gift and Home Furnishings Exhibition 2024 23/10/2025
Founded chip packaging (Bonding)workshop 01/12/2021 Bonding (Chip package) Department is also one of the highly automated departments of our company. The whole process of the packaging and testing of module
Indena 2025 Global Sources Hong Kong Spring Shows 3V13 31/03/2025 Indena-Spring 2025 Global Sources Hong Kong Shows 3V13 (Not in the exhibition hall,opposite KFC in the east lobby)