Bonding (Chip package) Department is also one of the highly automated departments of our company. The whole process of the packaging and testing of module

INDENA attend HK Global Sources Consumer Electronics Spring Show 2023 Exhibition：HK Global Sources Consumer Electronics Spring ShowDate：11-Apr-23 to 14-Apr-23Address：Asia-World Expo(Airport), Hong Kong SARBooth No.：8B40, 8D40,

Our company abides by the law, respects and cares for our employees. We have strong sense of social responsibility that attach great importance to repaying